dc.contributor.author | Civale, Yann | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Miyamori, Yuichi | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Redolfi, Augusto | |
dc.contributor.author | Thangaraju, Sarasvathi | |
dc.contributor.author | Van Ammel, Annemie | |
dc.contributor.author | Cherman, Vladimir | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Cockburn, Andrew | |
dc.contributor.author | Gravey, Virginie | |
dc.contributor.author | Kumar, Nirajan | |
dc.contributor.author | Cao, Zhitao | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Swinnen, Bart | |
dc.date.accessioned | 2021-10-21T06:59:39Z | |
dc.date.available | 2021-10-21T06:59:39Z | |
dc.date.issued | 2013 | |
dc.identifier.issn | 0167-9317 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/22152 | |
dc.source | IIOimport | |
dc.title | On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing | |
dc.type | Journal article | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Redolfi, Augusto | |
dc.contributor.imecauthor | Van Ammel, Annemie | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Cockburn, Andrew | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 155 | |
dc.source.endpage | 159 | |
dc.source.journal | Microelectronic Engineering | |
dc.source.volume | 106 | |
imec.availability | Published - open access | |