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Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects

dc.contributor.authorCroes, Kristof
dc.contributor.authorLi, Yunlong
dc.contributor.authorLofrano, Melina
dc.contributor.authorWilson, Chris
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-21T07:05:19Z
dc.date.available2021-10-21T07:05:19Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22187
dc.sourceIIOimport
dc.titleIntrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.source.peerreviewyes
dc.source.beginpage2C.3
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate14/04/2013
dc.source.conferencelocationMonterey, CA USA
imec.availabilityPublished - imec


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