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IMEC's activities in imagers and imager stacking

dc.contributor.authorDe Moor, Piet
dc.date.accessioned2021-10-21T07:09:48Z
dc.date.available2021-10-21T07:09:48Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22213
dc.sourceIIOimport
dc.titleIMEC's activities in imagers and imager stacking
dc.typeOral presentation
dc.contributor.imecauthorDe Moor, Piet
dc.source.peerreviewno
dc.source.conferenceAIDA - Academia meets Industry: Advanced interconnections for chip packaging in future detectors
dc.source.conferencedate8/04/2013
dc.source.conferencelocationFrascati Italy
imec.availabilityPublished - imec


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