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Key elements for sub-50μm pitch micro bump processes

dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorBuisson, Thibault
dc.contributor.authorGerets, Carine
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T07:12:13Z
dc.date.available2021-10-21T07:12:13Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22227
dc.sourceIIOimport
dc.titleKey elements for sub-50μm pitch micro bump processes
dc.typeProceedings paper
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1122
dc.source.endpage1126
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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