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Second level joint failures due to excessive warpage of advanced IC packages

dc.contributor.authorDebecker, Bjorn
dc.contributor.authorVandevelde, Bart
dc.contributor.authorWillems, Geert
dc.contributor.authorAllaert, Bart
dc.date.accessioned2021-10-21T07:13:05Z
dc.date.available2021-10-21T07:13:05Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22232
dc.sourceIIOimport
dc.titleSecond level joint failures due to excessive warpage of advanced IC packages
dc.typeMeeting abstract
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage165
dc.source.endpage166
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access
imec.internalnotesP6-07


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