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Interposer technology for high band width interconnect applications

dc.contributor.authorDetalle, Mikael
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorNolmans, Philip
dc.contributor.authorDaily, Robert
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T07:17:59Z
dc.date.available2021-10-21T07:17:59Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22257
dc.sourceIIOimport
dc.titleInterposer technology for high band width interconnect applications
dc.typeProceedings paper
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage323
dc.source.endpage328
dc.source.conference63rd Electronic Components And Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access


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