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High-volume wafer-level production of hyperspectral sensors for handheld devices

dc.contributor.authorDy, Eric
dc.contributor.authorJayapala, Murali
dc.contributor.authorLambrechts, Andy
dc.contributor.authorBaron, Jerome
dc.date.accessioned2021-10-21T07:26:40Z
dc.date.available2021-10-21T07:26:40Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22298
dc.sourceIIOimport
dc.titleHigh-volume wafer-level production of hyperspectral sensors for handheld devices
dc.typeOral presentation
dc.contributor.imecauthorJayapala, Murali
dc.contributor.imecauthorLambrechts, Andy
dc.contributor.imecauthorBaron, Jerome
dc.contributor.orcidimecJayapala, Murali::0000-0001-7917-0149
dc.contributor.orcidimecLambrechts, Andy::0000-0001-7592-2999
dc.source.peerreviewno
dc.source.conferenceTrillion Sensors Summit
dc.source.conferencedate23/10/2013
dc.source.conferencelocationStanford USA
imec.availabilityPublished - imec


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