dc.contributor.author | Dy, Eric | |
dc.contributor.author | Jayapala, Murali | |
dc.contributor.author | Lambrechts, Andy | |
dc.contributor.author | Baron, Jerome | |
dc.date.accessioned | 2021-10-21T07:26:40Z | |
dc.date.available | 2021-10-21T07:26:40Z | |
dc.date.issued | 2013 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/22298 | |
dc.source | IIOimport | |
dc.title | High-volume wafer-level production of hyperspectral sensors for handheld devices | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Jayapala, Murali | |
dc.contributor.imecauthor | Lambrechts, Andy | |
dc.contributor.imecauthor | Baron, Jerome | |
dc.contributor.orcidimec | Jayapala, Murali::0000-0001-7917-0149 | |
dc.contributor.orcidimec | Lambrechts, Andy::0000-0001-7592-2999 | |
dc.source.peerreview | no | |
dc.source.conference | Trillion Sensors Summit | |
dc.source.conferencedate | 23/10/2013 | |
dc.source.conferencelocation | Stanford USA | |
imec.availability | Published - imec | |