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Sealed ultra low-k organosilica films with unprecedented electrical and mechanical properties

dc.contributor.authorGoethals, F.
dc.contributor.authorLevrau, E.
dc.contributor.authorPollefeyt, G.
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorCiofi, Ivan
dc.contributor.authorVanstreels, Kris
dc.contributor.authorDetavernier, C.
dc.contributor.authorVan Driessche, I.
dc.contributor.authorVan Der Voort, P.
dc.date.accessioned2021-10-21T07:53:35Z
dc.date.available2021-10-21T07:53:35Z
dc.date.issued2013
dc.identifier.issn2050-7526
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22407
dc.sourceIIOimport
dc.titleSealed ultra low-k organosilica films with unprecedented electrical and mechanical properties
dc.typeJournal article
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewyes
dc.source.beginpage3961
dc.source.endpage3966
dc.source.journalJournal of Materials Chemistry C
dc.source.issue25
dc.source.volume1
dc.identifier.urlhttp://pubs.rsc.org/en/content/articlelanding/2013/tc/c3tc30522h#!divAbstract
imec.availabilityPublished - imec


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