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Thermo mechanical challenges for processing and packaging stacked ultrathin wafers

dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T07:55:15Z
dc.date.available2021-10-21T07:55:15Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22413
dc.sourceIIOimport
dc.titleThermo mechanical challenges for processing and packaging stacked ultrathin wafers
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage7
dc.source.endpage12
dc.source.conference63rd IEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access


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