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Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRadisic, Alex
dc.contributor.authorArmini, Silvia
dc.contributor.authorCivale, Yann
dc.contributor.authorLeunissen, Peter
dc.contributor.authorKondo, Muneharu
dc.contributor.authorWebb, Eric
dc.contributor.authorShingubara, Shoso
dc.date.accessioned2021-10-21T08:26:57Z
dc.date.available2021-10-21T08:26:57Z
dc.date.issued2013
dc.identifier.issn0013-4686
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22524
dc.sourceIIOimport
dc.titleElectroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
dc.typeJournal article
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage203
dc.source.endpage211
dc.source.journalElectrochimica Acta
dc.source.volume100
dc.identifier.urlhttp://dx.doi.org/10.1016/j.electacta.2013.03.106
imec.availabilityPublished - imec


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