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Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
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Authors
Inoue, Fumihiro
;
Philipsen, Harold
;
Radisic, Alex
;
Armini, Silvia
;
Civale, Yann
;
Leunissen, Peter
;
Kondo, Muneharu
;
Webb, Eric
;
Shingubara, Shoso
ISSN
0013-4686
Journal
Electrochimica Acta
Volume
100
Title
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Publication type
Journal article
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