Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Publication:

2013

Journal article

Author(s)

;

;

;

;

Civale, Yann

;

Leunissen, Peter

;

Kondo, Muneharu

;

Webb, Eric

;

Shingubara, Shoso

Electrochimica Acta

1864 since deposited on 2021-10-21

Acq. date: 2026-01-06