Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

dc.contributor.author	Inoue, Fumihiro
dc.contributor.author	Philipsen, Harold
dc.contributor.author	Radisic, Alex
dc.contributor.author	Armini, Silvia
dc.contributor.author	Civale, Yann
dc.contributor.author	Leunissen, Peter
dc.contributor.author	Kondo, Muneharu
dc.contributor.author	Webb, Eric
dc.contributor.author	Shingubara, Shoso
dc.contributor.imecauthor	Inoue, Fumihiro
dc.contributor.imecauthor	Philipsen, Harold
dc.contributor.imecauthor	Radisic, Alex
dc.contributor.imecauthor	Armini, Silvia
dc.contributor.orcidimec	Philipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimec	Armini, Silvia::0000-0003-0578-3422
dc.date.accessioned	2021-10-21T08:26:57Z
dc.date.available	2021-10-21T08:26:57Z
dc.date.issued	2013
dc.identifier.issn	0013-4686
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/22524
dc.identifier.url	http://dx.doi.org/10.1016/j.electacta.2013.03.106
dc.source.beginpage	203
dc.source.endpage	211
dc.source.journal	Electrochimica Acta
dc.source.volume	100
dc.title	Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
dc.type	Journal article
dspace.entity.type	Publication
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