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Microbump lithography for 3D stacking applications

dc.contributor.authorJaenen, Patrick
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.contributor.authorFlack, Warren W.
dc.contributor.authorRanjan, Manish
dc.contributor.authorKenyon, Gareth
dc.contributor.authorHsieh, Robert
dc.contributor.authorNguyen, Ha-Ai
dc.date.accessioned2021-10-21T08:30:21Z
dc.date.available2021-10-21T08:30:21Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22535
dc.sourceIIOimport
dc.titleMicrobump lithography for 3D stacking applications
dc.typeMeeting abstract
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorMiller, Andy
dc.source.peerreviewno
dc.source.conference10th International Wafer-Level Packaging Conference - IWPLC
dc.source.conferencedate4/11/2013
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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