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Plasma enhanced chemical vapor deposition of manganese on low-k dielectrics for copper diffusion barrier application

dc.contributor.authorJourdan, Nicolas
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorCroes, Kristof
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVancoille, Eric
dc.date.accessioned2021-10-21T08:37:24Z
dc.date.available2021-10-21T08:37:24Z
dc.date.issued2013
dc.identifier.issn2162-8726
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22558
dc.sourceIIOimport
dc.titlePlasma enhanced chemical vapor deposition of manganese on low-k dielectrics for copper diffusion barrier application
dc.typeJournal article
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVancoille, Eric
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.source.peerreviewyes
dc.source.beginpage25
dc.source.endpage27
dc.source.journalECS Solid State Letters
dc.source.issue3
dc.source.volume2
imec.availabilityPublished - imec


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