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Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic component

dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorPerinchery, S.M.
dc.contributor.authorSmits, E.C.P.
dc.contributor.authorMandamparabil, R.
dc.date.accessioned2021-10-21T08:41:55Z
dc.date.available2021-10-21T08:41:55Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22572
dc.sourceIIOimport
dc.titleLaser-induced forward transfer-assisted flip-chip bonding of optoelectronic component
dc.typeMeeting abstract
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecVandecasteele, Bjorn::0000-0002-6843-7124
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceConference on Lasers and Electro-Optics - International Quantum Electronics Conference - CLEO/Europe-IQEC
dc.source.conferencedate12/05/2013
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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