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DVS-BCB adhesive bonding for silicon photonics

dc.contributor.authorKeyvaninia, Shahram
dc.contributor.authorMuneeb, Muhammad
dc.contributor.authorStankovic, S.
dc.contributor.authorGhosh, Samir
dc.contributor.authorTassaert, Martijn
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.date.accessioned2021-10-21T08:46:30Z
dc.date.available2021-10-21T08:46:30Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22586
dc.sourceIIOimport
dc.titleDVS-BCB adhesive bonding for silicon photonics
dc.typeProceedings paper
dc.contributor.imecauthorMuneeb, Muhammad
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceConference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration - WaferBond '13
dc.source.conferencedate5/12/2013
dc.source.conferencelocationStockholm Sweden
imec.availabilityPublished - imec


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