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ULSI-device characterization using conductive scanning probes

dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorTrenkler, Thomas
dc.contributor.authorDe Wolf, Peter
dc.contributor.authorClarysse, Trudo
dc.contributor.authorHellemans, L.
dc.date.accessioned2021-09-30T09:56:56Z
dc.date.available2021-09-30T09:56:56Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2264
dc.sourceIIOimport
dc.titleULSI-device characterization using conductive scanning probes
dc.typeOral presentation
dc.contributor.imecauthorVandervorst, Wilfried
dc.source.peerreviewno
dc.source.conferenceMaterials Research Society 1997 Spring Meeting : Symposium on Materials/Failure Analysis for Silicon ULSI Processing; April 1-4
dc.source.conferencelocation
imec.availabilityPublished - imec


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