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Thermo-mechanical analysis of flip chip on substrate bumps - assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorRoggen, Jean
dc.contributor.authorPeeters, J.
dc.contributor.authorAllaert, K.
dc.date.accessioned2021-09-30T09:57:24Z
dc.date.available2021-09-30T09:57:24Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2266
dc.sourceIIOimport
dc.titleThermo-mechanical analysis of flip chip on substrate bumps - assemblies
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage603
dc.source.endpage606
dc.source.conferenceProceedings of the 11th ISHM European Microelectronics Conference - EMC
dc.source.conferencedate14/05/1997
dc.source.conferencelocationVenice Italy
imec.availabilityPublished - open access
imec.internalnotes


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