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The etching behavior of tungsten (w) with respect to the orientation of the grain boudnary and masking layers

dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorVan den hove, Luc
dc.contributor.authorLee, Hean-Cheal
dc.date.accessioned2021-09-30T09:57:50Z
dc.date.available2021-09-30T09:57:50Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2268
dc.sourceIIOimport
dc.titleThe etching behavior of tungsten (w) with respect to the orientation of the grain boudnary and masking layers
dc.typeOral presentation
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorVan den hove, Luc
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.conferenceMaterials Research Society 1997 Spring Meeting : Symposium on Multilevel Metal Process Integration; April 1-2, 1997; San Francis
dc.source.conferencelocation
imec.availabilityPublished - imec


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