TEM studies of processed Si device materials
dc.contributor.author | Vanhellemont, Jan | |
dc.contributor.author | Bender, Hugo | |
dc.contributor.author | Van Landuyt, J. | |
dc.date.accessioned | 2021-09-30T09:58:03Z | |
dc.date.available | 2021-09-30T09:58:03Z | |
dc.date.issued | 1997 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/2269 | |
dc.source | IIOimport | |
dc.title | TEM studies of processed Si device materials | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Bender, Hugo | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 393 | |
dc.source.endpage | 402 | |
dc.source.conference | Microscopy of Semiconducting Materials 1997 | |
dc.source.conferencedate | 7/04/1997 | |
dc.source.conferencelocation | Oxford UK | |
imec.availability | Published - open access | |
imec.internalnotes | IOP Conference Series; Vol. 157 |