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Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias

dc.contributor.authorMaestre Caro, Arantxa
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.contributor.authorMaes, Guido
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorArmini, Silvia
dc.date.accessioned2021-10-21T09:40:01Z
dc.date.available2021-10-21T09:40:01Z
dc.date.issued2013
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22741
dc.sourceIIOimport
dc.titleSelective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias
dc.typeJournal article
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage76
dc.source.endpage80
dc.source.journalMicroelectronic Engineering
dc.source.volume106
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931713000257
imec.availabilityPublished - open access


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