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Process integration study of packaging materials for implant applications

dc.contributor.authorMalachowski, Karl
dc.contributor.authorO'Callaghan, John
dc.contributor.authorLagae, Liesbet
dc.contributor.authorBraeken, Dries
dc.contributor.authorJans, Hilde
dc.contributor.authorMiyazaki, Tomakazu
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2021-10-21T09:42:32Z
dc.date.available2021-10-21T09:42:32Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22748
dc.sourceIIOimport
dc.titleProcess integration study of packaging materials for implant applications
dc.typeMeeting abstract
dc.contributor.imecauthorO'Callaghan, John
dc.contributor.imecauthorLagae, Liesbet
dc.contributor.imecauthorBraeken, Dries
dc.contributor.imecauthorJans, Hilde
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.source.peerreviewno
dc.source.beginpageSS3.19
dc.source.conferenceMRS Spring Meeting Symposium SS: Bioelectronics - Materials, Interfaces, and Applications
dc.source.conferencedate1/04/2013
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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