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Challenges and emerging solutions in testing 2.5D- and 3D-stacked ICs

dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-21T09:50:36Z
dc.date.available2021-10-21T09:50:36Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22769
dc.sourceIIOimport
dc.titleChallenges and emerging solutions in testing 2.5D- and 3D-stacked ICs
dc.typeOral presentation
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conference8th International Conference on Design and Technology of Integrated Systems in Nanoscale Era - DTIS
dc.source.conferencedate26/03/2013
dc.source.conferencelocationAbu Dhabi UAE
imec.availabilityPublished - imec


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