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From 2D boards to 3D chips: test and DfT challenges and solutions

dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-21T09:52:12Z
dc.date.available2021-10-21T09:52:12Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22774
dc.sourceIIOimport
dc.titleFrom 2D boards to 3D chips: test and DfT challenges and solutions
dc.typeOral presentation
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conferenceNordic Test Forum
dc.source.conferencedate26/11/2013
dc.source.conferencelocationTallinn Estonia
imec.availabilityPublished - imec


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