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Effect of chuck temperature adjustment on STI CDU and sensor wafer readouts

dc.contributor.authorMilenin, Alexey
dc.contributor.authorBoullart, Werner
dc.contributor.authorQuli, Farhat
dc.contributor.authorYouxian, Wen
dc.date.accessioned2021-10-21T10:04:46Z
dc.date.available2021-10-21T10:04:46Z
dc.date.issued2013-08
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22806
dc.sourceIIOimport
dc.titleEffect of chuck temperature adjustment on STI CDU and sensor wafer readouts
dc.typeProceedings paper
dc.contributor.imecauthorMilenin, Alexey
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecMilenin, Alexey::0000-0003-0747-0462
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewyes
dc.source.beginpage13
dc.source.endpage14
dc.source.conference35th International Symposium on Dry Process - DPS
dc.source.conferencedate29/08/2013
dc.source.conferencelocationJeju South Korea
imec.availabilityPublished - imec


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