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CMP Slurries for germanium substrates in FEOL applications

dc.contributor.authorOng, Patrick
dc.contributor.authorSiebert, Joerg Max
dc.contributor.authorNoller, Bastian
dc.contributor.authorLan, Yongqing
dc.contributor.authorLauter, Michael
dc.contributor.authorProells, Julian
dc.contributor.authorHuang, Kevin
dc.contributor.authorUsman Ibrahim, Sheik Ansar
dc.date.accessioned2021-10-21T10:36:54Z
dc.date.available2021-10-21T10:36:54Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22887
dc.sourceIIOimport
dc.titleCMP Slurries for germanium substrates in FEOL applications
dc.typeMeeting abstract
dc.contributor.imecauthorOng, Patrick
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization/CMP Technology
dc.source.conferencedate30/10/2013
dc.source.conferencelocationHsinchu Taiwan
imec.availabilityPublished - imec


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