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Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments

dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorJarboui, Ahmed
dc.contributor.authorCauwe, Maarten
dc.contributor.authorDeclercq, Heidi
dc.contributor.authorUytterhoeven, Griet
dc.contributor.authorCornelissen, Maria
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-21T10:37:44Z
dc.date.available2021-10-21T10:37:44Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22889
dc.sourceIIOimport
dc.titleImproved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments
dc.typeProceedings paper
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorUytterhoeven, Griet
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecUytterhoeven, Griet::0000-0001-7052-2590
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewyes
dc.source.beginpageTuA4
dc.source.conferenceIMAPS European Microelectronics Packaging Conference - EMPC
dc.source.conferencedate10/09/2013
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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