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Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts

dc.contributor.authorOprins, Herman
dc.contributor.authorBadaroglu, Mustafa
dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T10:38:32Z
dc.date.available2021-10-21T10:38:32Z
dc.date.issued2013-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22891
dc.sourceIIOimport
dc.titleNumerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBadaroglu, Mustafa
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage2183
dc.source.endpage2188
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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