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Integration of capillary self-alignment for Face to Face micro bump bonding

dc.contributor.authorPham, Nga
dc.contributor.authorDaily, Robert
dc.contributor.authorArmini, Silvia
dc.contributor.authorDelande, Tinne
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-21T10:55:38Z
dc.date.available2021-10-21T10:55:38Z
dc.date.issued2013-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22931
dc.sourceIIOimport
dc.titleIntegration of capillary self-alignment for Face to Face micro bump bonding
dc.typeProceedings paper
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewyes
dc.source.conferenceEuropean Microelectronics Packaging Conference - EMPC
dc.source.conferencedate9/09/2013
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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