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Photo-definable polyimide-based flat UTCP technology for 3D-stacking application

dc.contributor.authorPriyabadini, Swarnakamal
dc.contributor.authorSterken, Tom
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-21T11:06:24Z
dc.date.available2021-10-21T11:06:24Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22956
dc.sourceIIOimport
dc.titlePhoto-definable polyimide-based flat UTCP technology for 3D-stacking application
dc.typeProceedings paper
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceSmart Systems Integration
dc.source.conferencedate13/03/2013
dc.source.conferencelocationAmsterdam The Netherlands
imec.availabilityPublished - open access


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