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Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking

dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDaily, Robert
dc.contributor.authorGerets, Carine
dc.contributor.authorDuval, Fabrice
dc.contributor.authorWang, Teng
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-21T11:20:08Z
dc.date.available2021-10-21T11:20:08Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22987
dc.sourceIIOimport
dc.titleDeveloping underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking
dc.typeProceedings paper
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage124
dc.source.endpage129
dc.source.conference15th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate11/12/2013
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6745697
imec.availabilityPublished - open access


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