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Flip-chip assembly for chips with gold bumps on high density thic film substrates

dc.contributor.authorVrana, M.
dc.contributor.authorVan Calster, Andre
dc.contributor.authorVan den Berghe, R.
dc.contributor.authorAllaert, K.
dc.date.accessioned2021-09-30T10:05:06Z
dc.date.available2021-09-30T10:05:06Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2298
dc.sourceIIOimport
dc.titleFlip-chip assembly for chips with gold bumps on high density thic film substrates
dc.typeProceedings paper
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage175
dc.source.endpage182
dc.source.conferenceProceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy.
dc.source.conferencelocation
imec.availabilityPublished - imec


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