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dc.contributor.authorSuhard, Samuel
dc.contributor.authorSimms, Ihsan
dc.contributor.authorBrown, Ian
dc.contributor.authorShogo, Mizota
dc.contributor.authorKoji, Kagawa
dc.contributor.authorClaes, Martine
dc.contributor.authorBuisson, Thibault
dc.contributor.authorJourdain, Anne
dc.contributor.authorBeyer, Gerald
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-21T12:27:08Z
dc.date.available2021-10-21T12:27:08Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23133
dc.sourceIIOimport
dc.titleDevelopment of integrated wet cleans for 3D-SIC technologies
dc.typeProceedings paper
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage150
dc.source.endpage153
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces XI - UCPSS
dc.source.conferencedate17/09/2012
dc.source.conferencelocationGent Belgium
dc.identifier.urlhttp://www.scientific.net/SSP.195.150
imec.availabilityPublished - open access
imec.internalnotesSolid State Phenomena; Vol. 195


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