Show simple item record

Impact of mid-bond Testing in 3D stacked ICs

dc.contributor.authorTaouil, Mottaqiallah
dc.contributor.authorHamdioui, Said
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorBhawmik, Sudipta
dc.date.accessioned2021-10-21T12:38:12Z
dc.date.available2021-10-21T12:38:12Z
dc.date.issued2013-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23157
dc.sourceIIOimport
dc.titleImpact of mid-bond Testing in 3D stacked ICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage178
dc.source.endpage183
dc.source.conferenceIEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems - DFT
dc.source.conferencedate2/10/2013
dc.source.conferencelocationNew York, NY USA
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6653603
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record