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Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects

dc.contributor.authorVan Besien, Els
dc.contributor.authorSingh, Arjun
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-21T13:10:13Z
dc.date.available2021-10-21T13:10:13Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23221
dc.sourceIIOimport
dc.titleDevelopment and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorSingh, Arjun
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage105
dc.source.endpage106
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access
imec.internalnotesP4-04


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