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Integration techniques and applications of thin chips on low cost foil substrates

dc.contributor.authorvan den Ende, Daan
dc.contributor.authorSridhar, Ashok
dc.contributor.authorvan den Brand, Jeroen
dc.contributor.authorCauwe, Maarten
dc.contributor.authorVandecasteele, Bjorn
dc.date.accessioned2021-10-21T13:14:13Z
dc.date.available2021-10-21T13:14:13Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23229
dc.sourceIIOimport
dc.titleIntegration techniques and applications of thin chips on low cost foil substrates
dc.typeProceedings paper
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceSmart Systems Integration
dc.source.conferencedate13/03/2013
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - open access


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