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dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorVereecke, Bart
dc.contributor.authorMasahito, Sugiura
dc.contributor.authorKashiwagi, Yusaki
dc.contributor.authorCott, Daire
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-21T13:20:40Z
dc.date.available2021-10-21T13:20:40Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23243
dc.sourceIIOimport
dc.titleElectrical improvement of CNT contacts with Cu damascene top metallization
dc.typeProceedings paper
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorCott, Daire
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.source.peerreviewyes
dc.source.beginpage13-Mar
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate13/06/2013
dc.source.conferencelocationKyoto Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615601&contentType=Conference+Publications
imec.availabilityPublished - imec


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