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Optoelectronics packaging for efficient chip-to-waveguide coupling

dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorBosman, Erwin
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Hoe, Bram
dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorKalathimekkad, Sandeep
dc.contributor.authorTeigell Beneitez, Nuria
dc.contributor.authorElmogi, Ahmed
dc.date.accessioned2021-10-21T13:34:05Z
dc.date.available2021-10-21T13:34:05Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23271
dc.sourceIIOimport
dc.titleOptoelectronics packaging for efficient chip-to-waveguide coupling
dc.typeOral presentation
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorTeigell Beneitez, Nuria
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceEuropean Conference and Exhibition on Optical Communication: European Cluster in Optical Interconnects Workshop
dc.source.conferencedate22/09/2013
dc.source.conferencelocationLondon UK
imec.availabilityPublished - open access


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