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IC-package interaction

dc.contributor.authorVandevelde, Bart
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorDebecker, Bjorn
dc.contributor.authorLofrano, Melina
dc.contributor.authorVanstreels, Kris
dc.contributor.authorGuo, Wei
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-21T13:43:21Z
dc.date.available2021-10-21T13:43:21Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23290
dc.sourceIIOimport
dc.titleIC-package interaction
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE
dc.source.conferencedate14/04/2013
dc.source.conferencelocationWroclaw Poland
imec.availabilityPublished - imec


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