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Dealing with IC package material and design uncertainties using FUZZY finite elements

dc.contributor.authorVandevelde, Bart
dc.contributor.authorKonstantinou, Ionnas
dc.contributor.authorMoens, David
dc.contributor.authorVandepitte, Dirk
dc.date.accessioned2021-10-21T13:43:47Z
dc.date.available2021-10-21T13:43:47Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23291
dc.sourceIIOimport
dc.titleDealing with IC package material and design uncertainties using FUZZY finite elements
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.conferenceIEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE
dc.source.conferencedate14/04/2013
dc.source.conferencelocationWroclaw Poland
imec.availabilityPublished - imec


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