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Reduced solder joint lifetime due to introduction of low- CTE (green) mould compounds

dc.contributor.authorVandevelde, Bart
dc.contributor.authorThijs, Steven
dc.contributor.authorWillems, Geert
dc.date.accessioned2021-10-21T13:44:14Z
dc.date.available2021-10-21T13:44:14Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23292
dc.sourceIIOimport
dc.titleReduced solder joint lifetime due to introduction of low- CTE (green) mould compounds
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorThijs, Steven
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecThijs, Steven::0000-0003-2889-8345
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.source.peerreviewno
dc.source.conferenceSoldertec - Tomorrow's Solders Conference
dc.source.conferencedate5/03/2013
dc.source.conferencelocationSlough UK
imec.availabilityPublished - imec


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