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Assessment of mechanical properties in nanotechnology: porous low-k dielectrics, TSVs and bumps

dc.contributor.authorVanstreels, Kris
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorHangen, Ude
dc.date.accessioned2021-10-21T13:51:34Z
dc.date.available2021-10-21T13:51:34Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23307
dc.sourceIIOimport
dc.titleAssessment of mechanical properties in nanotechnology: porous low-k dielectrics, TSVs and bumps
dc.typeMeeting abstract
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.conferenceNanobrueken-Dresden. A Nanomechanical Testing Workshop & Hysitron User Meeting
dc.source.conferencedate20/03/2013
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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