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Si Interposer build-up options and impact on 3D system cost

dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDetalle, Mikael
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-21T13:54:07Z
dc.date.available2021-10-21T13:54:07Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23312
dc.sourceIIOimport
dc.titleSi Interposer build-up options and impact on 3D system cost
dc.typeProceedings paper
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conferenceIEEE 3D System Integration Conference
dc.source.conferencedate2/10/2013
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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