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A novel method to measure the internal pressure of MEMS thin-film packages

dc.contributor.authorWang, Bo
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorWevers, Martine
dc.date.accessioned2021-10-21T14:25:01Z
dc.date.available2021-10-21T14:25:01Z
dc.date.issued2013
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23371
dc.sourceIIOimport
dc.titleA novel method to measure the internal pressure of MEMS thin-film packages
dc.typeJournal article
dc.contributor.imecauthorWang, Bo
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage1663
dc.source.endpage1666
dc.source.journalMicroelectronics Reliability
dc.source.issue9_11
dc.source.volume53
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271413002746
imec.availabilityPublished - imec
imec.internalnotes24th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF


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