Wafer-scale Cu plating uniformity on thin Cu seed layers
dc.contributor.author | Yang, Liu | |
dc.contributor.author | Atanasova, Tanya | |
dc.contributor.author | Radisic, Alex | |
dc.contributor.author | Deconinck, Johan | |
dc.contributor.author | West, Alan | |
dc.contributor.author | Vereecken, Philippe | |
dc.date.accessioned | 2021-10-21T14:49:58Z | |
dc.date.available | 2021-10-21T14:49:58Z | |
dc.date.issued | 2013 | |
dc.identifier.issn | 0013-4686 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/23417 | |
dc.source | IIOimport | |
dc.title | Wafer-scale Cu plating uniformity on thin Cu seed layers | |
dc.type | Journal article | |
dc.contributor.imecauthor | Radisic, Alex | |
dc.contributor.imecauthor | Vereecken, Philippe | |
dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 242 | |
dc.source.endpage | 248 | |
dc.source.journal | Electrochimica Acta | |
dc.source.volume | 104 | |
dc.identifier.url | http://dx.doi.org/10.1016/j.electacta.2013.04.094 | |
imec.availability | Published - imec |
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