Show simple item record

Wafer-scale Cu plating uniformity on thin Cu seed layers

dc.contributor.authorYang, Liu
dc.contributor.authorAtanasova, Tanya
dc.contributor.authorRadisic, Alex
dc.contributor.authorDeconinck, Johan
dc.contributor.authorWest, Alan
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-21T14:49:58Z
dc.date.available2021-10-21T14:49:58Z
dc.date.issued2013
dc.identifier.issn0013-4686
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23417
dc.sourceIIOimport
dc.titleWafer-scale Cu plating uniformity on thin Cu seed layers
dc.typeJournal article
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpage242
dc.source.endpage248
dc.source.journalElectrochimica Acta
dc.source.volume104
dc.identifier.urlhttp://dx.doi.org/10.1016/j.electacta.2013.04.094
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record