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Role of oxygen and cuprous ions in copper electroplating

dc.contributor.authorYang, Liu
dc.contributor.authorMarchal, Wouter
dc.contributor.authorRadisic, Alex
dc.contributor.authorDeconinck, Johan
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-21T14:50:30Z
dc.date.available2021-10-21T14:50:30Z
dc.date.issued2013-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23418
dc.sourceIIOimport
dc.titleRole of oxygen and cuprous ions in copper electroplating
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage103
dc.source.endpage104
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access
imec.internalnotesP4-03


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