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Modeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism

dc.contributor.authorYang, Liu
dc.contributor.authorRadisic, Alex
dc.contributor.authorDeconinck, Johan
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-21T14:51:00Z
dc.date.available2021-10-21T14:51:00Z
dc.date.issued2013
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23419
dc.sourceIIOimport
dc.titleModeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism
dc.typeJournal article
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageD3051
dc.source.endpageD3056
dc.source.journalJournal of the Electrochemical Society
dc.source.issue12
dc.source.volume160
imec.availabilityPublished - open access


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