Authors

Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe

ISSN

0013-4651

Issue

12

Journal

Journal of the Electrochemical Society

Volume

160

Title

Modeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism

Publication type

Journal article

Embargo date

9999-12-31