Publication:

Modeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism

Date

2013
Journal article
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-4115-0075
cris.virtual.orcid0000-0002-6699-1615
cris.virtualsource.department319bcb05-51e0-4ebd-82cd-03314b82dce9
cris.virtualsource.department12de27c7-869f-445c-8ac5-1dad7854aab4
cris.virtualsource.orcid319bcb05-51e0-4ebd-82cd-03314b82dce9
cris.virtualsource.orcid12de27c7-869f-445c-8ac5-1dad7854aab4
dc.contributor.authorYang, Liu
dc.contributor.authorRadisic, Alex
dc.contributor.authorDeconinck, Johan
dc.contributor.authorVereecken, Philippe
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-21T14:51:00Z
dc.date.available2021-10-21T14:51:00Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23419
dc.source.beginpageD3051
dc.source.endpageD3056
dc.source.issue12
dc.source.journalJournal of the Electrochemical Society
dc.source.volume160
dc.title

Modeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism

dc.typeJournal article
dspace.entity.typePublication
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